Taiwan's semiconductor giant to open chip design centre in Munich

Taiwan Semiconductor Manufacturing Co. (TSMC), the world’s leading contract chipmaker, will establish a new chip design centre in Munich, Germany, a company executive announced on May 27.

Speaking at TSMC’s 2025 Technology Symposium, Paul de Bot, President of TSMC Europe, said the Munich Design Centre is scheduled to open in the third quarter of 2025, Caliber.Az reports, citing Western media.

"The centre is designed to assist European customers in developing high-density, high-performance, and energy-efficient chips, with a particular focus on automotive, industrial, AI, and IoT applications," de Bot explained.

The announcement comes as TSMC continues its expansion in Europe through a joint venture with Infineon, NXP, and Robert Bosch to build a semiconductor fabrication plant in Dresden. The facility, known as the European Semiconductor Manufacturing Company (ESMC), aims to strengthen Europe's position in advanced chip manufacturing.

Notably, Taiwan Semiconductor Manufacturing Co. (TSMC) is a cornerstone of the global semiconductor industry, responsible for producing chips used by major technology firms including Apple, NVIDIA, AMD, and Qualcomm. As the largest contract chipmaker globally, TSMC plays a critical role in the supply of advanced semiconductors that power everything from smartphones and data centers to autonomous vehicles and industrial machinery.

The Dresden plant, operated under the name European Semiconductor Manufacturing Company (ESMC), is part of the EU’s broader strategy to boost semiconductor self-sufficiency. This effort is backed by the EU Chips Act, which aims to double Europe’s share of global chip production from 10% to 20% by 2030. The facility is being developed in partnership with key European semiconductor players—Infineon, NXP Semiconductors, and Robert Bosch—with production expected to begin by 2027.

Munich is one of Europe’s major technology hubs, particularly strong in automotive and industrial engineering. Locating the design centre there enables TSMC to collaborate more closely with European clients and tap into local engineering talent. The centre will focus on creating chips for next-generation applications in automotive (including electric and autonomous vehicles), artificial intelligence (AI), the Internet of Things (IoT), and industrial automation—areas where Europe seeks to enhance its technological leadership.

By Khagan Isayev